Iphone 4 U62 Lifted BGA Solder Pad ! ios version issue

Home  >>  iPhone  >>  Iphone 4 U62 Lifted BGA Solder Pad ! ios version issue

Iphone 4 U62 Lifted BGA Solder Pad ! ios version issue

On March 28, 2015, Posted by , In iPhone, With Comments Off on Iphone 4 U62 Lifted BGA Solder Pad ! ios version issue

Hi,


I removed U62 audio IC but lifted one of the pads, you can see it in the picture

is this too difficult to fix?

Regards title=smile

No Comment so far:

  1. Ann Elmore says:
    Quote:
    Learntofly83
    Hi,

    I removed U62 audio IC but lifted one of the pads, you can see it in the picture

    is this too difficult to fix?

    Regards title=smile

    hello friend, i checked an saw that that pin was not important pin. it was fake pin, dont you worry about it.

  2. julianz says:

    Hello friend,

    Thank you for your expert advice..

    I read a lot of tutorials by you and wites, you two are masters title=smile

    Regards

  3. Metaton says:

    Just an update, a replacement U62 arrived from china and I successfully soldered the BGA chip to the board Along with hot air (290 degrees on the gun for about 2 minutes)

    I am kindly Along with myself because this is the first BGA chip I replaced (new to iPhone repair). One small issue, the volume cannot be changed from the buttons WHILST in a phone call, can only change from settings.. I guess maybe not all of the solder balls made connection?

  4. TechWorld says:

    Hi, I got an iphone 4 Along with microphone cipsetu defect and tried to make him a reflow and now the phone does not start, what could have happened?